The Fabrication of Electronic Packages from High Silicon Aluminium Alloys
The Fabrication of Electronic Packages from High Silicon Aluminium Alloys Metal Matrix Composite (MMC) materials are finding increasing use within the electronics packaging industry due to their excellent coefficient of thermal expansion (CTE), stiffness and thermal management properties. Unfortunately, these composites are not easily electroplated due to the nonconducting phases that make up a high proportion of the surface. Such limitations can be overcome by utilising a spray formed aluminium/silicon alloy which can be compositionally modulated to achieve thermal matching to the electronic materials currently in use. Get more news about Electronic Packaging Silicon Aluminum Alloy ,you can vist our website! This group of alloys, manufactured by Osprey Metals and known as the CE alloys, may be easily electroplated. These alloys can be fabricated readily into electronic packages by conventional machining with tungsten carbide or polycrystalline diamond (PCD) tools and electro-discha